Virtual Interface Technology for 3D-IC Metrology: TSV profile (depth, top & bottom CD) , Remaining Silicon Thickness (RST), Copper Nail Height, Bump Height and Cu pillar Height, Edge trim profile.
Dimensional metrology system for 3D-IC application: Through Silicon Via (TSV) depth, top CD, bottom CD, remaining silicon thickness (RST), copper pillar height, bump height, and many more. Fully automated cassette to cassette system for 300mm wafers. SECS/GEM option. Warp, Roughness, and Thin Film Thickness measurement options.
Frontier Semiconductor moved to its new location: 165 Topaz St., Milpitas, CA 95035, USA.May 01, 2018
FSM will be presenting at Semicon West in San Francisco, Ca, July 9-11, 2019. Please visit us at booth #243 in the South Hall.Jul 09, 2019
FSM will be presenting at SPIE Photonics West in San Francisco, Ca, February 2 -7, 2019.Feb 02, 2019