Frontier Semiconductor, Inc, (FSM), offers a range of advanced metrology products and solutions for semiconductor, LED, Solar, FPD, Data Storage and MEMS applications. We have over 25 years experience in stress measurement, film adhesion testing, wafer topography metrology, and electrical characterization. Our latest offerings include unique technology to meet the metrology needs of 3DIC manufacturing. We have shipped our first 450mm wafer tools.
FSM has local sales and support offices in all major semiconductor clusters. Other areas are covered by a network of local representatives.
Management driven by Customer satisfaction offers the Best-Known-Method in our customized metrology solutions.
Partnership with major OEMs to enable 300mm and 450mm eco-system and to align with fabs' cost reduction initiative.
Full line of front end electrical characterization tools: Sheet Resistance, leakage, and CV-IV measurements.
Stress Hysteresis Measurement up to 500C for thermal property and stability tests of thin films in air.
Non-Contact Laser Scanning Technology.
Model: 500TC |
Model: Aeto-Tech |
Nano Topography of dies:
1nm vertical resolution in single images sized up to 30mm x 40mm