Raman 360 and FSM127

Local and Lattice Stress Measurement, Die level Topography. For in-die and in-device stress and composition control.

Raman-360

Micro Raman system  for lattice level strain and material composition measurement. High spectral resolution (0.02 cm-1) and sub micron lateral resolution. Measurement of through silicon via (TSV) keep out zone, local stress and composition profiling.  Fully automated C2C system.

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Frontier Semiconductor moved to its new location: 165 Topaz St., Milpitas, CA 95035, USA.

May 01, 2018

FSM will be presenting at Semicon West in San Francisco, Ca,  July 9-11, 2019. Please visit us at booth #243 in the South Hall.

Jul 09, 2019

FSM will be presenting at SPIE Photonics West in San Francisco, Ca, February 2 -7, 2019. 

Feb 02, 2019