Film adhesion testing of thin films and stacks on substrates for material evaluation.
Modified Edge Liftoff Test to measure adhesion of thin film and thin film stacks on a wide variety of crystalline and non-crystaline substrates, such as Silicon, III-V compounds, glass, etc. Suitable for mid adhesion samples.
4-Point Bend film adhesion test. Measurement in air or liquid. For low to mid adhesion samples. Multi-chamber option for rapid testing.