Vacuum Lamination of high-tech products has seen explosive growth in the last decade. Until now no system offered the level of vacuum, coupled with the use of positive pressure, that FSM DPL Differential Pressure Laminator provides.
No pressure is applied to the lamination sandwich during the Vacuum Dwell therefore maximum evacuation is assured.
During the Pressure Dwell, a flexible diaphragm compresses and encapsulates the product and true Isostatic lamination is achieved.
These features open the door for many new and exciting applications and clearly position the FSM DPL as the most technologically advanced device of its kind…with a cost/benefit ratio sure to please the most demanding purchaser.

APPLICATIONS
Initially conceived for laminating films onto printed circuit boards, new applications are being developed at a steady rate. Among them are:

1. Lamination of Film Mask to BGA and micro BGA products.
2. Lamination of Primary Imaging Film onto 3-Dimensional Surfaces.
3. Evacuation of Liquid Photo-Imageable Solder Mask.
4. Lamination of Dielectric Coating in Preparation for the Screening of Additional Circuitry.
5. Application of tape-supported strippable encapsulant for chip-scale interconnect processing.
6. Lamination of pressure-sensitive adhesives to glass and other substrates for flat panel displays.
7. Application of Coatings for Multi-wire Boards.

In addition, tests are being conducted which will permit the use of the DPL as the first high vacuum, single cavity, isostatic, multilayer press on the market.