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Quantitative Adhesion Testing
  • MELT (Modified Edge Lift Off Technique)
  • FSM Laminar -160 C to +100 C
  • Heat/Cryostat chamber with imaging system for detecting debond temperature and software for calculations of fracture energy of thin film on substrates
  • Certified Epoxy material Sample preparation kit
  • On site set up and training
  • Applications for Si and Glass and GaAs substrates


    Features
    • The only one supplier in IC industry for modified edge lift-off tester.
    • The only supplier for Epoxy used in MELT test.
    • Provides Epoxy coating tool kits.
    • Can handle up to 30 samples per test.
    • Simple test to get adhesion strength in K_ic or G values.