| Necessity of Decapsulation Decapsulation work examines errors that have been made while manufacturing packaged chip. When 
a chip is judged as inferior goods, it should be analyzed whether the inferiority occurs during package process or wafer process. Accurate failure analysis allows immediate feedback to the manufacture process, increasing the yield so that it can contribute to the overall productivity improvement significantly. Not only for semiconductor manufacturing company but also for companies which use semiconductor parts, it can contribute to productivity improvement and secure reliability through quality control by analyzing the failure factors through decapsulation work. Conventionally, the decapsulation process was executed manually while using noxious chemicals such as fuming nitric or sulfuric acid, causing hazardous problems. Also, the process reproducibility was not secure. MIS Decapsulation Technology As the package type becomes various and the size becomes smaller, it becomes impossible to work manually. MIS Auto Decaper is the world first equipment that opens these packaged parts automatically and accurately. Also, it allows any inexperienced engineer to remove EMC (Epoxy Molding Compounds) accurately and easily through GUI (Graphic User Interface) without any chemical attack to the user and permits to expose dies and bonded wires without causing damages to the electric characteristics of IC or to expose the first bond and the second bond at the same time. It can decap any special area or overall by user’s decision. In case that the packaged IC is judged as inferior after decapsulation, user can analyze where the inferiority occurs, during packaging process or during wafer process. This accurate inferiority analysis is immediately sent back to the manufacturing factory, consequently increasing the yield and assuring the product reliability as well as improving the overall productivity. MIS Auto Decaper Excellent Software Control System MIS Auto Decaper can control the 
equipment’s condition inspection and all movements through the computer using GUI process control system. Also, it has safety device to stop the equipment movements when it is in unusual condition or malfunctioned by user’s mistake and It is programmed to initialize automatically within 1 minute by clicking just one button, so any inexperienced user can use it easily. User can set milling area freely looking at the enlarged image by monitor. While chemical process, you can control freely not only dropping
amount, dropping speed, dropping location of chemical but also heating temperature, shower frequency, ultrasonic on/off, drying hour etc.Also, user can control starting location by controlling each motor, customize setting of all kinds of alarms, control sensors in order to optimize the workmanship through the computer. The best merit of all is that you can make and use the recipe file according to the process of each chip’s shape and characters. After finishing a process, user save the process in recipe file, afterward user just click only one button to finish all processes. It can make up to 1,000 unit process per chip and user can copy and attach to other unit process from another. User can also save result image progressed by each process. It supplies Jig part in order to fix various packages like BGA, QFP, DIP, CSP, TSOP, MCM etc. And it can decap 3mm X 3mm sample which was considered impossible to be decaped without damaging original form. Features
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