 Vacuum Lamination of high-tech products has seen explosive growth in the last decade. Until now no system offered the level of vacuum, coupled with the use of positive pressure, that FSM DPL Differential Pressure Laminator provides.
No pressure is applied to the lamination sandwich during the Vacuum Dwell therefore maximum evacuation is assured. During the Pressure Dwell, a flexible diaphragm compresses and encapsulates the product and true Isostatic lamination is achieved. These features open the door for many new and exciting applications and clearly position the FSM DPL as the most technologically advanced device of its kind…with a cost/benefit ratio sure to please the most demanding purchaser. APPLICATIONS Initially conceived for laminating films onto printed circuit boards, new applications are being developed at a steady rate. Among them are:
The latest technological developments in the industry, coupled with a massively constructed vacuum vessel, assure the purchaser of many years of trouble-free operation. THEORY OF OPERATION The DPL-24 Differential Pressure Laminator has been designed to give the operator a flexible method for laminating sheet support¬ed emulsions onto a variety of substrates. These substrates, pre-laminated either manually or with the assistance of currently available dispensing equipment, are placed on the slide mounted platen and positioned in the chamber. Substrates varying in thickness and geometry may be intermixed to increase throughput. The fully automated cycle is activated from the front panel and controlled by a microprocessor driven Programmable Controller. Utilizing a high vacuum (42 CFM), rotary vane pump, a vacuum end point below 2 Torr is achieved. This vacuum is displayed on a computer calibrated digital gauge located on the front panel. The substrate is exposed to this Vacuum Dwell for a time determined by a precision digital timer that is adjustable from .1 seconds to infinity. Following this period, a preheated silicone rubber diaphragm descends onto the workpiece. This action closes the small gap below the spring-mounted platen assembly and provides direct thermal contact with the lower heat platen. The temperatures of both the upper and lower Heated Platens are controlled independently by microprocessor based Temperature Controllers. Unlike conventional Vacuum Laminators, the DPL-24 permits the addition of positive pressure above the diaphragm, increasing the effective lamination pressure dramatically. The Pressure Dwell period is adjusted with a timer identical to that employed in the Vacuum Dwell. Upon completion of a cycle, the drawer mechanism is retracted and the products removed for further processing. SPECIFICATIONS 
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