Material Characterization
| 密着度の定量分析 |
- MELT (Modified Edge Lift Off Technique)
- FSM Laminar -160 C to +100 C
- Heat/Cryostat chamber with imaging system for detecting debond temperature and software for calculations of fracture energy of thin film on substrates
- Certified Epoxy material Sample preparation kit
- On site set up and training
- Applications for Si and Glass and GaAs substrates
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| Features |
- The only one supplier in IC industry for modified edge lift-off tester.
- The only supplier for Epoxy used in MELT test.
- Provides Epoxy coating tool kits.
- Can handle up to 30 samples per test.
- Simple test to get adhesion strength in K_ic or G values.
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