Material Characterization
| Integrated Metrology Annealing Chamber |
|---|
Rapid Thermal Mechanical Evaluation of low k, Copper, Barrier, High k, novel materials. |
1) Film Stress Hysteresis Studies 2) Thermal Stability Evaluation 3) Thermal Desorption Spectra 4) Shrinkage Studies 5) Reflectivity Studies 6) Coefficient of Thermal Expansion Measurements |
Features
Fast and Simultaneous multiple metrology on same wafer . Avoids tool to tool and sample variation problems associated with multiple tool sets. |



Rapid Thermal Mechanical Evaluation of