Material Characterization
| FSM pioneered in the laser scanning technology for Film Stress and wafer bow measurement. Several hundred of these tools have been installed in almost every fab, and R&D facilities for Si, GaAS, InP or Flat panel facilities. Systems are available for room and high temperatures. |
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High temperature Stress measurements for characterization of thermal properties of new films and process development is available with the following products: FSM 500TC - Stress measurements from ambient to 500 degrees C, for samples up to 200 mm FSM 900LT - Stress Measurements from -90 deg C to 550 deg C FSM 900TC-vac - Stress Measurements from Ambient to 900 deg C, with options up to 1000 degrees C, for both 200 and 300 mm wafers. Operates in a controlled, oxygen free environment, under vacuum or inert gas.
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Features
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