FSM

FRONTIER SEMICONDUCTOR

Products

Stress Hysteresis for dielectric, organic and metal films
FSM 500TC with rotation
FSM 900TC-vac with vacuum/purging
FSM TCVac-Cu – 300 for 300 mm Cu
Quantitative Adhesion Testers
Aquaflex – 4 Point Bend
Laminar
Die Flexer

Material Characterization

Quantitative Adhesion Testing 4 Point Bend
FSM Aquaflex 4 point bent system for Low k, copper, barrier film adhesion strength studies Stress induced fractures or failures
Testing conditions: (a) Room Temp or Variable temperature option (b) Ambient or in liquid Cohesive Strength Testing and crack velocity Options Features Multiple Chambers for Rapid Characterization Integrated Sample Preparation and training package for rapid lab setup

Features
Provides sample preparation kits and methods in sample preparation work. Provides up to 6 chambers per tool. Easy to learn and operate.

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Frontier News

FSM proudly presents our latest offering:

Non contact resistivity on solar cell

FSM RTH surface roughness profiler

VideoMic and InnerVision

Auto IC de-caper

Resistivity with heat up to 500C

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