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Products
- Stress Hysteresis for dielectric, organic and metal films
- FSM 500TC with rotation
- FSM 900TC-vac with vacuum/purging
- FSM TCVac-Cu – 300 for 300 mm Cu
- Quantitative Adhesion Testers
- Aquaflex – 4 Point Bend
- Laminar
- Die Flexer
Material Characterization
| Stress Hysteresis for dielectric, organic and metal films FSM 500TC with rotation FSM 900TC-vac with vacuum/purging FSM TCVac-Cu – 300 for 300 mm Cu |
| Quantitative Adhesion Testers Aquaflex – 4 Point Bend Laminar Die Flexer |
Frontier News
FSM proudly presents our latest offering:
Non contact resistivity on solar cell
FSM RTH surface roughness profiler
VideoMic and InnerVision
Auto IC de-caper
Resistivity with heat up to 500C
Non contact resistivity on solar cell
FSM RTH surface roughness profiler
VideoMic and InnerVision
Auto IC de-caper
Resistivity with heat up to 500C