FSM

FRONTIER SEMICONDUCTOR

Applications

Thin Film Stress
Raman Spectroscopy Principle
Thermal Stress Analysis Concept
Echoprobe Thickness Measurement
Non-Contact Sheet Resistance and Leakage Current RsL
Metal Contamination (MC) & Equivalent Oxide Thickness (EOT)
4 Point Bend Adhesion
Melt Adhesion

Applications

Stress and Strain

Film Stress and Wafer Bow
Local Stress and Flatness
Lattice Stress by Micro-Raman
Stress Hysteresis (Stress vs. Temperature)

Sheet Resistance and Leakage Current

USJ (pn-junctions)

Topography, Wafer and Membrane Thickness
Material Characterization

Adhesion
Metal Contamination
Equivalent Oxide Thickness (CV)
TDS
Reflectivity

Photovoltaic

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Frontier News

FSM proudly presents our latest offering:

Non contact resistivity on solar cell

FSM RTH surface roughness profiler

VideoMic and InnerVision

Auto IC de-caper

Resistivity with heat up to 500C

More...