• Film Stress and Wafer Bow
• Local Stress and Flatness
• Lattice Stress by Micro-Raman
• Stress Hysteresis (Stress vs. Temperature)

Sheet Resistance and Leakage Current

• USJ (pn-junctions)

Topography, Wafer and Membrane Thickness
Material Characterization

• Adhesion
• Metal Contamination
• Equivalent Oxide Thickness (CV)
• TDS
• Reflectivity
  

• SPV

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